Meet us at PACK EXPO International 2026 in Chicago.

Deep Detection is heading to Chicago! We are thrilled to announce our participation in PACK EXPO International 2026, the premier event for packaging and processing innovation.

As the industry faces increasingly complex safety and quality challenges, we are bringing our next-generation PhotonAi products directly to the exhibition floor. Standard X-ray systems often miss low-density foreign bodies or fail to detect any objects in complex products. Our multi-energy imaging enhances brand protection with no compromise on your production line.

Meet our team, including David Ciudad, Ignacio Cantonnet and Colin Burnham, to explore the latest advances in product and packaging inspection technology.

We look forward to connecting with industry leaders, machine integrators, and food processors. Stop by our booth to discover how we can help you make every photon count, or reach out to our team in advance to schedule a dedicated one-on-one meeting before, during or after the event.