We are here to be your partner for better inspection. At Deep Detection , we give in-line inspection companies the power to see what others can’t, eliminating hidden risks and assuring product quality. Our X-ray line detectors harness advanced photon-counting technology to deliver true spectral imaging in every single pixel.
We design our products and interfaces to be intuitive and easy to use then we partner to find the most impactful applications
We are systematic in our business systems and keep our external radars tuned, ready to adapt when conditions change so we can always be responsive to our clients
Communication and trusting each others intent is fundamental to the success navigation of any project and we always value a conversation
We believe we are at our best as part of team with a shared vision around a deep challenge and even when the rhythm of life changes unexpectedly we can embrace the learnings and keep passing the ball
Since 2020 Deep Detection has been a leader in the field of photon counting inspection and we have been launching at least one new industrial product a year since 2024. Today we operate a global supply chain and are an established customer of some of the worlds best know names in semiconductors.
We design every element of our products in-house starting from the pixels that perform the photon counting in our own ASICs. Our approach unifies the microelectronics, physics, AI and user experience through one multi-disciplinary team with a passion to keep raising the bar.
Our quality control starts on the hardware side with in-house testing of the wafers that we produce to verify that each pixel can be relied upon to perform to our high standards. Procurement requires compliance to material specifications and acceptance at incoming goods inspection prior to entering assembly lines.
Software development follows rigorous end to end testing both horizontally and vertically through the software stack from firmware to user API. New features are only rolled out after completion of end user testing under industrial conditions.
Advanced microelectronics packaging is performed at a specialist location using high speed assembly to perfectly our bond ASIC to our direct conversion detectors. Production of the finished products is carried out at our installations near to Barcelona where each camera model is integrated and version controlled with traceable components.

Visit our demonstration space to see for yourself the unbelievable power of photon counting. Our product managers are available to consult regarding solutions for your inspection challenges and our application engineers can run live tests on belted machines or a stand alone test cabinet.